UltraTemp™ Performance

UltraTemp™ Performance Overview:

Table 1 shows the total resistance of a 1sq. in. sample using a 1oz copper layer, a 1mm thick aluminum substrate for the MCPCB, Anotherm and HTI UltraTemp™ methods.The conductivity shown was figured using the Rtotal value listed and an appropriate thickness for the bonding agent, 1mm aluminum and 1 oz. copper layer.

Table 1-Effective Conductivites of the LED Boards
Material	Rtotal (C in2/W)1	K(W/mk)2
MCPCB	0.629	2.8
Anotherm	0.135	11.72
UltraTemp™	0.064	24.92
1Total Resistance of 1oz. Copper Layer, bonding agend and 1mm Al Substrate
2Thermal Conductivity Based on Rtotal and appropriate stack-up thickness with 1mm Al Substrate

For example the data for the MCPCB material was calculated as follows:

First, the resistance of each component layer was calculated:

For the Aluminum:

For the Epoxy:

For the Copper:

Since the resistances are taken over equivalent areas and operate in series they can be simply summed.

 

since the resistance is taken over a 1in.² area.

 

To get the total thickness of the board, the thicknesses of the component layers are summed.

 

Finally, the effective overall conductivity can be determined using the overall thickness, overall resistance and 1in.² area.