Thermal Engineering Consulting

HTI engineers have decades of experience in understanding our customers’ design requirements. We are experts at quickly creating high quality products. We offer a full range of thermal engineering services from chip & pc board characterization through complete chassis and system thermal and airflow analysis and design. Our state-of-the-art lab is equipped to provide the detail and accuracy required to solve the toughest thermal challenges quickly.

 

Using our fully equipped, state of the art thermal laboratory and CFD tools including FLOTHERM, HTI has a proven track record of inventing new heat-sink technologies enabling high-end thermal solutions where current technology falls short.

 

Thermasink is HTI’s trademarked, empirical based set of proprietary thermal design programs that work with industry standard mechanical 3-D and thermal modeling software packages giving extremely accurate results. Experimental results are plotted in minutes, allowing quick, iterative insight into price/performance curves.

 

Heat Technology’s in house analysis, design, engineering, and quick turn prototyping coupled with our domestic and offshore manufacturing facilities contribute solid performance to our customer’s bottom line.