Thermal Interface Materials

 

MicroPin Interface Material™

The micropin interface material provides a good balance between excellent thermal performance and strong attachment with easy installation. No mechanical fasteners are required. Thermal performance exceeds 0.35 C-in.2/W and 8 psi lap shear.

 

Phase Change Interface Material

HTI's phase change thermal interface provides an extremely high thermal conductivity bond between a heatsink and hot IC component. The thermal resistance of this bond can be 0.03C-in2/W or lower depending upon attachment pressure.

 

ThickStuff Interface Material

ThickStuff provides you with a way to easily fill large gaps or flatness irregularities with heat conductive material. As much as 0.25 inches can be spanned by Thickstuff. Extremely flexible and compressive, ThickStuff can allow you to put several irregular height components on one large heatsink or to pot a hot component to an exterior wall.