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| IntelŪ CPU Thermal Solutions |
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IntelŪ ItaniumŪ 2 Thermal Solutions
IntelŪ Xeon™ Solutions
| HTI created the SuperSink™ technology
to directly address the cooling requirements of high speed CPU's for today and
tomorrow. SuperSink™ technology enables a significant improvement in
cooling capability of low profile and high performance heat sinks using low
airflow requirements. SuperSink™ technology provides a scaleable
approach for cooling future generations of Intel's 32 and 64-bit family of
products. |
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| Thermal performance can be significantly
improved with an increase in airflow allowing the flexibility to meet design
requirements of chips up to 150 watts. SuperSink™ also intuitively
lends itself to active "fan-on-sink" applications. Its nearly
infinite height and width combinations can easily be matched with a variety of
industry standard fans to create an optimum high end thermal solution using
minimum space. |
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| SuperSink ™ technology enables IntelŪ, PentiumŪ,
Xeon™ and ItaniumŪ Microprocessors to run at full rated power in 1U
and Blade systems, without compromising required cooling specifications.
SuperSink™ technology is at the core of HTI's thermal solutions, which
Intel has tested and approved in product reference designs. |
