Intel® CPU Thermal Solutions

Intel® Xeon™ Solutions

HT130466 Passive Heatsink - SuperSink™II Technology for 1U, low profile, full power solution for Intel® 32/64 bit Xeon™ processors with up to 2 MB L2 Cache (Nokona/Irwindale).

SuperSink™ II technology represents a significant improvement in the design of low profile and high performance heat sinks and thermal solutions. SuperSink™ II technology provides a documented and scaleable upgrade path, for high performance Intel® Pentium®, Xeon™, Itanium® and Itanium® 2 microprocessors. SuperSink™ II technology allows a full range of thermal solutions capable of meeting the requirements for cooling the hottest 1U, 2U and blade server designs.

 

These heatsinks are capable of cooling microprocessors dissipating up to 150 watts of power in minimum space, with low airflow requirements.

 

The HT130466 Passive heatsink was designed and tested to meet the 1U server reference design full power thermal requirements of the 32/64 bit Intel® Xeon™ processor family with up to 2 MB L2 cache (Nokona/Iwrindale).

http://download.intel.com/design/Xeon/guides/30625001.pdf

Key Features:

Computer optimized fin array and base thickness provides superior thermal performance.

HTI's patented Turbohole technology reduces boundary layer effects resulting in
    improved fin array performance.

Heatsink design meets Intel® reference design weight requirements for the CEK retention system.

Captive retention hardware reduces assembly costs.

 

Design Highlights:

Copper on copper construction provides maximum heat transfer performance for a wide variety of
    Intel® Xeon™ processors in 1U server applications.

Designed to withstand the rigorous shock and vibration requirements of today's 1U server market.

Plug and play compatible with Intel's proven CEK retention hardware.

 

To Order:

HTI PartNumber	Description
HT130466	Intel® Xeon™ processor family (Nocona/Irwindale) 1U low profile passive thermal solution. Includes captive mounting hardware and thermal interface material.

 

 

Tests conducted at HTI's state of the art test lab, using Intel® Xeon™ Thermal Test Vehicles. All testing was performed using Intel® recomended metodologies and procedures.

 

What makes it work? TURBOHOLES!

Holes present upon the fin faces create a local turbulence for extra heat transfer. HTI's patented Turbohole technology enables the industries highest performing heatsinks.