Heat Technology Inc. Home Page - 978.422.7100 Sterling, MA

Sterling Ma

(978) 422 - 7100

Email Us

Intel® Itanium® 2 Thermal Solutions

SuperSink™ technology represents a significant improvement in the design of high performance, low profile heat sinks and thermal solutions. SuperSink™ technology provides a documented and scaleable upgrade path, for high performance Intel® Pentium®, Xeon™, Itanium® and Itanium® 2 microprocessors. SuperSink™ technology allows a full range of compact thermal solutions capable of meeting requirements for cooling the hottest 1U, 2U and blade server designs.

		SuperSink™ technology combines intelligent classical heat transfer design principles with our new patent pending heat transfer concept of TurboHoles.

TurboHoles are small circular or rectangular holes punched from the surfaces of the folded fin faces in specific patterns determined by computer modeling and empirical testing. This technology enables broad new system design capability and scalability for field upgrades. Heat Technology, Inc. has patents pending on the thermal design concept and the manufacture of TurboHole fins. TurboHoles significantly increase the heat transfer from the fins into the passing air stream, allowing SuperSink™ to perform to very low thermal impedance with minimal airflow and pressure drop requirements.

Pressure Drop SuperSink™ .625" Fin Height		Thermal Impedance SuperSink™ .625" Fin Height.

SuperSink™ technology is inherently flexible, providing easy integration and superior thermal performance in even the most highly constrained design applications. SuperSink™ technology is a must for computer systems requiring N+1 redundancy and computer systems designed for use in harsh environments.

These are some examples of how the SuperSink™ can be modified to fit your applications.
		This picture shows how the core can be expanded or contracted allowing SuperSink™ to be tailored for exceptional performance on a wide variety of chip and die packages
		Here is an example of some of the many fin heights of SuperSink™ that we have manufactured. SuperSinkT fin height can be made to meet your exact design requirements from .125" up to 2".
		This is an oval version of SuperSink™ designed to cool Intel® Itanium® and Itanium® 2 microprocessors in the world's first Intel® Itanium® 1U server. These heat sinks are less than an inch high and can cool chips up to 150 watts with minimum airflow.


These pictures show how SuperSink™ intuitively lends itself to active "fan-on-sink" applications. SuperSink's™ nearly infinite height and width combinations can easily be matched with a variety of industry standard fans to create an optimum high end thermal solution using minimum space.

SuperSink™ heat sinks are designed and tested to meet the 1U server reference design thermal requirements, for the Intel® Itanium® and Itanium® II microprocessors. These heat sinks are capable of cooling microprocessors dissipating up to 150 watts of power in minimum space with low airflow requirements.

SuperSink™ heat sinks are key components in the Intel® Itanium® processor, 1U server reference design: Celestica Thermal Solution:

Intel® Itanium® processor Support Components Webpage
Celestica Itanium 2 Workstation Webpage

SuperSink™ heat sinks enable low profile and blade server designs using Intel® Itanium® and Itanium® 2 microprocessors to run at full rated power and still meet Intel's thermal design specifications.

Performance beyond that specified by Intel can be further improved with minor changes in geometry or airflow, allowing these systems to meet "harsh environment" and "critical application" requirements.

Intel®, Pentium®, Xeon™, Itanium® are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.