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Heat Technology Provides Thermal Solutions for Netronome Network Flow Processors

Heat Technology Reference Design Heat Sinks Shorten Development Time

Sterling, MA – May 28th– Heat Technology Inc., a global leader in electronics cooling, announced today the immediate availability of low profile, high-performance heat sinks designed for the Netronome NFP-32xx family of Network Flow Processors.

Heat Technology Inc.(HTI) is a Netronome ecosystem partner. We work closely with Netronome engineers to ensure these reference design heat sinks provide superior cooling of NFP-32xx processors in the harshest of thermal environments.

These new heat sink designs enable developers to quickly identify the right thermal solution for their particular application. HTI's reference design heat sinks have been developed to meet or exceed the heat dissipation requirements of the Netronome NFP-32xx processors in a wide variety of applications including ATCA and other low profile and environmentally challenging applications.

Reference design heat sinks provide an established benchmark of thermal performance shortening the development time necessary for application specific, custom modifications and performance verification. HTI's reference design heat sinks and extensive thermal simulation and engineering design experience, enables developers to get their products to market in the shortest possible time.