What's New:
HTI introduces new thermal solutions for IntelŪ Xeon™ &
PentiumŪ D, Dual Core Prescott processors
HTI introduces new thermal solutions for the high
performance IntelŪ
Xeon™ processors, & PentiumŪ D, Dual Core Prescott processors expanding
its leading edge position in cooling 1U, Low Profile and Blade computer
systems.
Our IntelŪ Xeon™ & PentiumŪ D processor thermal solutions enable maximum
quality, flexibility and reliability to be integrated into our customer's
product design strategies.
HTI is proud to be working closely with Intel to insure our leading edge
thermal solutions meet Intel's latest, up-to-date design requirements.
Intel recognizes HTI as a supplier of support components developed for IntelŪ
XeonT processor-based system designs on their web site. To view the entire list
visit:Intel's
web site
SuperSink™ II
HTI proudly announces our newest heat sink design.
SuperSink™ II
Heat Technology Inc. provides volume manufacturing, state
of the art thermal analysis and design services. We are the experts you can
work with and count on, to design, prototype, test and manufacture, thermal
solutions and products that meet your exact requirements.
Heat Technology Inc. has a proven track record of
inventing new heat-sink technologies enabling high-end thermal solutions where
current technology falls short.
We have extensive experience in solving complex heat
transfer problems in all types of applications including, but not limited to:
computer, medical, laser, telecommunications, commercial, industrial,
aerospace, military.
